Measurement of the dimensions of a cylindrical component having two axial terminations (IEC 40/2072/CD:2010)
€84.58
Reliability Methodology for Electronic Systems - FIDES Guide 2009 issue A - Méthodologie de fiabilité pour les systèmes électroniques
€405.00
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010.
€111.40
Standard Test Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt-60 Irradiators Used in Radiation-Hardness Testing of Silicon Electronic Devices
This product is not for sale, please contact us for more information
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G (IEC 40/2058/CD:2010)
€77.20
IEEE Standard for Signal and Test Definition
€454.00
Standard data elements types with associated classification scheme for electric items Definitions. Principles and methods
€404.00
Surface mounting technology - Part 3 : standard method for the specification of components for Through Hole Reflow (THR) soldering
€111.67
Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose in Radiation-Hardness Testing of Electronic Devices
Safety of machinery. Electrical equipment machines General requirements
Process management for avionics. Preparation of an electronic components management plan
€269.00
IEEE Standard Framework for Reliability Prediction of Hardware
€92.00
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 40/2032/CD:2009)
€134.02
Packaging of components for automatic handling surface mount on continuous tapes. Type VI. Blister carrier tapes 4 mm width
€165.00
Packaging of components for automatic handling surface mount on continuous tapes. Type V. Pressed carrier tapes
€193.00
