31.020 : Electronic components in general

DIN EN 60300-3-12:2011-08

DIN EN 60300-3-12:2011-08

Active Most Recent

Dependability management - Part 3-12: Application guide - Integrated logistic support (IEC 60300-3-12:2011); German version EN 60300-3-12:2011.

€157.10

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DIN IEC/PAS 62565-2-1*DIN SPEC 40565-2-1:2012-05

DIN IEC/PAS 62565-2-1*DIN SPEC 40565-2-1:2012-05

Withdrawn Most Recent

Nanomanufacturing - Material specifications - Part 2-1: Single-wall carbon nanotubes - Blank detail specification (IEC/PAS 62565-2-1:2011)

€84.58

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DIN EN 60286-3-1:2010-02

DIN EN 60286-3-1:2010-02

Superseded Historical

Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes (IEC 60286-3-1:2009); German version EN 60286-3-1:2009.

€84.58

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DIN EN 60286-3-2:2010-02

DIN EN 60286-3-2:2010-02

Superseded Historical

Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width (IEC 60286-3-2:2009); German version EN 60286-3-2:2009.

€77.20

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DIN EN 62137-1-5:2010-01

DIN EN 62137-1-5:2010-01

Active Most Recent

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009

€105.42

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DIN EN 61760-3:2010-12

DIN EN 61760-3:2010-12

Superseded Historical

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010.

€111.40

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DIN EN 60286-4:2010-10

DIN EN 60286-4:2010-10

Superseded Historical

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G (IEC 40/2058/CD:2010)

€77.20

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DIN IEC 62622:2011-07

DIN IEC 62622:2011-07

Superseded Historical

Nanotechnologies - Description, measurement, and dimensional quality parameters of artificial gratings (IEC 113/102/CD:2011)

€122.34

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DIN EN 61709:2012-01

DIN EN 61709:2012-01

Superseded Historical

Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2011); German version EN 61709:2011.

€214.30

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DIN CLC/TS 50466:2006-12

DIN CLC/TS 50466:2006-12

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Long duration storage of electronic components - Specification for implementation; German version CLC/TS 50466:2006

€111.40

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DIN EN 61760-1:2006-10

DIN EN 61760-1:2006-10

Superseded Historical

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006.

€111.40

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DIN EN 60286-3:2014-02

DIN EN 60286-3:2014-02

Superseded Historical

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013); German version EN 60286-3:2013.

€128.22

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DIN EN 60286-4:2014-04

DIN EN 60286-4:2014-04

Active Most Recent

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (IEC 60286-4:2013); German version EN 60286-4:2013.

€98.32

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DIN IEC/TS 62607-5-1*DIN SPEC 42607-5-1:2014-03

DIN IEC/TS 62607-5-1*DIN SPEC 42607-5-1:2014-03

Superseded Historical

Nanomanufacturing - Key control characteristics - Part 5-1: Thin-film organic/nano electronic devices - Carrier transport measurements (IEC 113/183/CD:2013)

€67.48

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DIN IEC/TS 62647-2*DIN SPEC 42647-2:2013-09

DIN IEC/TS 62647-2*DIN SPEC 42647-2:2013-09

Active Most Recent

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)

€143.83

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