Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
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Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering (IEC 91/994/CD:2011)
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Standard Guide for Universal Oxidation/Thermal Stability Test Apparatus
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Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
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Environmental testing - Part 2-5: Tests - Test Sa: Simulated solar radiation at ground level and guidance for solar radiation testing
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Standard Practice for Conditioning and Testing Flexible Barrier Packaging
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
€286.00
Environmental testing - Part 3-1: Supporting documentation and guidance - Cold and dry heat tests
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Standard Practice for Liquid Penetrant Testing
Environmental testing - Part 2-58: Test - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 91/963/CD:2011)
Environmental testing Tests. Test Sa. Simulated solar radiation at ground level and guidance for
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Standard Practice for Atmospheric Environmental Exposure Testing of Nonmetallic Materials
