Optics and photonics - Preparation of drawings for optical elements and systems - Part 14: Wavefront deformation tolerance (ISO 10110-14:2007)
€69.91
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)
Technical product documentation - Part references (ISO/DIS 6433:2010); German version prEN ISO 6433:2010
€48.79
Geometrical product specifications (GPS) - Geometrical tolerancing - Datums and datum systems (ISO 5459:2011); German version EN ISO 5459:2011
€190.65
Graphical layout and documentation of wells and ground water measuring points
€105.42
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1028/CD:2013)
€41.78
Technical drawings - Construction drawings - Representation of modular sizes, lines and grids (ISO/FDIS 8560:2018); German and English version prEN ISO 8560:2018
€63.27
Technical product documentation (TPD) - Technical drawings for glassware (ISO/DIS 6414:2018); German and English version prEN ISO 6414:2018
€84.58
Welding and allied processes - Symbolic representation on drawings - Welded, brazed and soldered joints (ISO/DIS 2553:2011); German version prEN ISO 2553:2011
€140.00
Optics and photonics - Preparation of drawings for optical elements and systems - Part 8: Surface texture; roughness and waviness (ISO 10110-8:2010)
Ships and marine technology - System co-ordination plans in shipbuilding; Text in German and English
€128.22
Technical product documentation - Three-dimensional CAD-models - Part 3: Features
€91.03
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 47D/802/CD:2011)
€98.32
Welding in aerospace - Welded metallic components - Indications in design documents and general design requirements
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)
