Semiconductor devices. Mechanical and climatic test methods Measurement of moisture diffusivity water solubility in organic materials used for semiconductor components
€165.00
Connectors for frequencies below 3 MHz use with printed boards Detail specification two-part connectors assessed quality, boards, basic grid of 2,54 mm (0,1 in) common mounting features
€404.00
Static transfer systems (STS) General and safety requirements
€374.00
Communication cables. Specifications for test methods Electromagnetic performance. Coupling attenuation of cable assemblies (field conditions)
€193.00
Fibre optic connector optical interfaces Optical interface 2,5 mm and 1,25 diameter cylindrical PC composite ferrule using Cu-Ni-alloy as fibre surrounding material, single mode
Specification for insulating materials based on mica Specifications individual Commutator separators and
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape. Format D-7 VTR specifications
Specification for insulating materials based on mica Specifications individual Polyester film-backed paper with a B-stage epoxy resin binder
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape. Format D-7 Compression format
Specification for insulating materials based on mica Specifications individual Gloss-backed paper with a B-stage epoxy resin binder
Specification for insulating materials based on mica Specifications individual Polyester film paper with an epoxy resin binder single conductor taping
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape. Format D-7 Data stream format
€269.00
Methods of measurement for DVD players
TeleWeb application Hyperteletext profile
€316.00
Pressure-sensitive adhesive tapes for electrical purposes Specifications individual materials Cellulose paper, creped and non-creped, with rubber thermosetting
