Soft soldering fluxes. Test methods Copper corrosion test
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Soft soldering fluxes. Test methods Determination of flux spattering
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Semiconductor devices. Discrete devices General
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Pinnacles Component Information Standard 1.2 The SGML declaration and document type definitions (DTDs)
Harmonized system of quality assessment for electronic components Detail specification. Rectangular connectors. Flat contacts, 0,8 mm thickness, locking screw not detachable
€316.00
Harmonized system of quality assessment for electronic components Detail specification. High density rectangular connectors, round removable crimp contacts
Mechanical structures for electronic equipment. Dimensions of mechanical the 482.6 mm (19 in) series Subracks and associated plug-in units. Additional dimensions
Data requirements for semiconductor die. Specific and recommendations Electrical simulation
Data requirements for semiconductor die. Specific and recommendations Thermal
Specified time relays for industrial use Requirements and tests
€269.00
Harmonized system of quality assessment for electronic components. Detail specification Specification: Two-part connectors printed boards having a grid 2,54 mm, short version in compliance with CECC 75101-801, assessed
Hearing aids with induction pick-up coil input
Methods of measurement of touch current and protective conductor current
Maritime navigation and radiocommunication equipment and systems. Marine speed and distance measuring equipment (SDME). Performance requirements. Methods of testing and required test results
Data requirements for semiconductor die General
