Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine pitch land grid array (FLGA) Proposed amendment on terminology
€193.00
Communication cables. Specifications for test methods. Mechanical methods General requirements
€165.00
Communication cables. Specifications for test methods. Electrical methods Dielectric strength
Maritime navigation and radiocommunication equipment systems Shipborne automatic transponder system installation using VHF digital selective calling (DSC) techniques. Operational performance requirements, methods of testing required test results
€355.00
Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method Section 7: 12g:
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
€316.00
Methods for the analysis of pewter. Determination of alloying and impurity element contents by atomic spectrometry
Data requirements for semiconductor die. Particular and recommendations die types Bare
Electromechanical components for electronic equipment. Basic testing procedures and measuring methods Test 20b. Flammability tests. Fireproofness Section 2: 20b -
Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Dynamic stress tests Test 6e. Random vibration Section 5: 6e:
Data requirements for semiconductor die. Particular and recommendations die types Bare with added connection structures
Video recording. Helical-scan digital component video cassette recording format using 12,65mm magnetic tape and incorporating data compression (Format digital-L)
€404.00
Connectors with assessed quality, for use in d.c., low-frequency analogue and digital high speed data applications Cable outlet accessories including qualification capability approval. Sectional specification
Semiconductor devices. Integrated circuits. Digital integrated circuits Blank detail specification for programmable logic devices (PLDs)
€269.00
Data requirements for semiconductor die. Exchange data formats and dictionary
