Documentation on design automation subjects. Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)
€193.00
Mechanical standardization of semiconductor devices Design guideline open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Land (FLGA)
€269.00
Flanges for waveguides Relevant specifications flanges ordinary rectangular
€374.00
Electronic fee collection. Evaluation of on-board and roadside equipment for conformity to EN ISO/TS 12813 Abstract test suite
Touch and interactive displays Reliability test methods of touch displays. Environmental durability
Electronic fee collection. Evaluation of on-board and roadside equipment for conformity to EN ISO 13141 Abstract test suite
Connectors for electronic equipment. Product requirements Detail specification free and fixed connectors data transmission with frequencies up to 3 000 MHz
Power supplying scheme for wearable systems and equipment
EMC IC modelling Models of integrated circuits for RF immunity behavioural simulation. Conducted (ICIM-CI)
€404.00
Intelligent transport systems. Emergency evacuation and disaster response recovery Framework concept of operation
Communication cables Common design rules and construction. General
€165.00
Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements
Electronic fee collection. Evaluation of on-board and roadside equipment for conformity to EN 15509 Abstract test suite
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength micro bonding area
Semiconductor devices. Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) method for semiconductor devices
