| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Alemán |
Vigente |
1/3/2021 |
96,13 € |
|
||
Detalles
MID technology enables the integration of mechanical, electrical, electronic, and thermal functions on a spatial circuit carrier. This enables assemblies with a high functional density and a considerable degree of miniaturization. At present, however, there are no generally applicable standards for the manufacture of MIDs that process managers and customers can use as a guideline. This standard provides detailed information on laser direct structuring. It is aimed at users and producers of mechatronically integrated assemblies.
Información adicional
| Autor | Verein Deutscher Ingenieure (VDI) |
|---|---|
| Publicado por | VDI |
| Tipo de Documento | Norma |
| ICS | 31.220.01 : Componentes electromecánicos en general
39.020 : Máquinas de precisión |
| Número de páginas | 21 |
| Reemplaza | VDI/VDE 3719 Blatt 1 (2019-05) |
| Colección | VDI/VDE-Handbuch Fertigungsmesstechnik,VDI-Handbuch Produktionstechnik und Fertigungsverfahren Band 3 |
| Palabra clave | VDI 3719, VDI 3719 Blatt 1, VDI/VDE 3719, 3719 |
