| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Inglés |
Vigente |
1/11/2000 |
19,00 € |
|
||
Detalles
The research summarized in this paper will help to address some of the issues associated with solder paste reflow assembly of 02\01 components. Attachment pad design, stencil design, component-to-component spacing, component orientation, flux type, and solder paste reflow atmosphere were the major variables researched during the project. The two major responses from the experimentation were assembly yield and assembly quality.
Información adicional
| Autor | Society of Manufacturing Engineers |
|---|---|
| Publicado por | SME |
| Tipo de Documento | Norma |
| Tema | /subgroups/9442 |
| Número de páginas | 13 |
| Palabra clave | SME EE00-161 |
