Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
---|---|---|---|---|---|---|---|
PDF sécurisé |
Inglés |
Vigente |
1/10/2014 |
204,00 € |
|
Detalles
This Test Method defines a procedure for evaluation of die strength by mean of cantilever bending where 3 point bending is not easy to measure strength in case of wafer thickness less than 50 μm.
This Test Method applies only for cantilever bending method, and other methods will be defined by separate documents.
This Test Method is used to measure die strength for dies from processed wafers.
Información adicional
Autor | Semiconductor Equipment and Materials Institute (SEMI) |
---|---|
Publicado por | SEMI |
Tipo de Documento | Norma |
Fecha de confirmación | 2019-10-01 |