SEMI G96-1014 ( Reapproved 10/19) (R2019)

SEMI G96-1014 ( Reapproved 10/19) (R2019)

Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending

204,00 €

Detalles

This Test Method defines a procedure for evaluation of die strength by mean of cantilever bending where 3 point bending is not easy to measure strength in case of wafer thickness less than 50 μm.



This Test Method applies only for cantilever bending method, and other methods will be defined by separate documents.



This Test Method is used to measure die strength for dies from processed wafers.

Información adicional

Autor Semiconductor Equipment and Materials Institute (SEMI)
Publicado por SEMI
Tipo de Documento Norma
Fecha de confirmación 2019-10-01