| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF sécurisé |
Inglés |
Vigente |
1/9/1996 |
204,00 € |
|
||
Detalles
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018, originally published in 1996, previously published August 2011.
NOTICE: This Document was reapproved with minor editorial changes.
This Document describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three-point bending techniques.
This Document may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a guideline.
The methods in this Document use SI units.
Información adicional
| Autor | Semiconductor Equipment and Materials Institute (SEMI) |
|---|---|
| Publicado por | SEMI |
| Tipo de Documento | Norma |
| Fecha de confirmación | 2018-03-01 |
| Reemplaza | SEMI G69-0996 (Reapproved 1104) |
