| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF sécurisé |
Inglés |
Vigente |
1/9/1996 |
204,00 € |
|
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Detalles
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018, originally published in 1986, previously published August 2011.
This Document provides the requirements for a standard thermal resistance test board to be used in junction-to-ambient thermal resistance measurement of a semiconductor package under still- and forced-air condition as a referee method.
Información adicional
| Autor | Semiconductor Equipment and Materials Institute (SEMI) |
|---|---|
| Publicado por | SEMI |
| Tipo de Documento | Norma |
| Fecha de confirmación | 2018-03-01 |
