| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF sécurisé |
Inglés |
Vigente |
1/4/2019 |
360,00 € |
|
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Detalles
The purpose of this overview Document is to provide a basic set of terminology and reference documents for SEMI E49.2, SEMI E49.4, SEMI E49.5, SEMI E49.6, SEMI E49.7, SEMI E49.8 and SEMI E137.
This Document contains terminology and reference documents used in SEMI E49.2, SEMI E49.4, SEMI E49.5, SEMI E49.6, SEMI E49.7, SEMI E49.8, and SEMI E137, which will reference performance and method standards as well as recommended practices.
The SEMI E49 Subordinate Documents are organized by types of piping distribution systems: gas, DI/chemical, solvent, and by types of assembly and testing procedures: subassembly for stainless steel, subassembly for polymer and final tool assembly. Final assemblies should be tested or validated for all appropriate parameters (e.g., purity, integrity, failure rate) as specified in the applicable SEMI E49 Subordinate Documents.
The piping distribution Documents (SEMI E49.2 through SEMI E49.8) include guidelines for system design, performance, materials, and components. Purity and performance grades are described for each of the three types of distribution systems.
Users should complete an overall tool cost of ownership analysis (see SEMI E35) to determine the optimum application of HP or UHP tool features. Key parameters should include facilities cost and installation cycle time, piping system reliability and maintainability factors, tool and sub-system contribution to contamination, and resultant effects on wafer quality and wafer throughput factors.
Final assemblies should be evaluated according to the criteria of SEMI S2 for environmental, health and safety (EH&S) issues associated with their use.
Información adicional
| Autor | Semiconductor Equipment and Materials Institute (SEMI) |
|---|---|
| Publicado por | SEMI |
| Tipo de Documento | Norma |
