SEMI 3D20-0719

SEMI 3D20-0719

Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications

204,00 €

Detalles

Panel Level Packaging (PLP) is projected to become a critical packaging process. This Specification identifies the physical properties that must be specified for the semiconductor industry to produce an equipment set for successful implementation of PLP. Many of the applications for panel packaging lines include fan-out technology applications.



To permit common processing equipment, standardized panel (largest external) dimensions (whether with or without process carrier) are essential.



To accelerate the adoption of panel level packaging by eliminating the need to customize equipment and processes for a variety of panel sizes.



This Specification focuses on panel (largest external) dimensions (whether with or without process carrier) for use in PLP applications.



The term panel is used to include panel (largest external) dimensions (whether with or without process carrier).



Other optional parameters are included as an Appendix to this Specification.

Información adicional

Autor Semiconductor Equipment and Materials Institute (SEMI)
Publicado por SEMI
Tipo de Documento Norma