SEMI 3D19-0619

SEMI 3D19-0619

Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling

204,00 €

Detalles

The purpose of this Document is to establish the standard for the adhesive strength test method of adhesive tray used for thin chip handling and shipping.



This Document covers measuring system (system configuration, die pick up tool).



This Document states test method (die mount layout, measurement environment, peeling speed etc.).

Información adicional

Autor Semiconductor Equipment and Materials Institute (SEMI)
Publicado por SEMI
Tipo de Documento Norma