SEMI 3D10-0814 (Reapproved 04/20) (R2020)

SEMI 3D10-0814 (Reapproved 04/20) (R2020)

Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack

204,00 €

Detalles

This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS-IC process.



This Guide provides the tools to describe individual wafers in a 3DS-IC process. In particular, this Document provides direction for describing the dimensions, materials, and devices for wafers that have undergone processing and are entering 3D stacking process steps. Since a 3D stacking process may include wafers from multiple fabrication facilities, it is important that this information is available to ensure additional process steps are performed correctly.



This Guide describes wafers and wafer stacks with nominal diameter of 300 mm and nominal thickness of 775 µm, although the actual wafer diameter and/or thickness may differ due to 3D stacking requirements and/or the effects of prior processing steps.

Información adicional

Autor Semiconductor Equipment and Materials Institute (SEMI)
Publicado por SEMI
Tipo de Documento Norma
Fecha de confirmación 2020-04-01