| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Inglés |
Vigente |
1/6/2019 |
58,00 € |
|
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Detalles
Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical Shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This document also replaces JESD22-B104.
Información adicional
| Autor | JEDEC Solid State Technology Association |
|---|---|
| Publicado por | JEDEC |
| Tipo de Documento | Norma |
| Tema | /subgroups/36080 |
| Número de páginas | 14 |
| Reemplaza | JEDEC JESD22-B110B,JEDEC JESD22-B104C (R2009),JEDEC JESD 22-B110A (R2009) |
| Palabra clave | JEDEC JESD22-B110B.01 |
