| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Inglés |
Vigente |
1/7/2021 |
55,12 € |
|
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Detalles
The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices. The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to failure distributions of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration. During the test, accelerated stress temperatures are used without electrical conditions applied. This test may be destructive, depending on time, temperature and packaging (if any).
Información adicional
| Autor | JEDEC Solid State Technology Association |
|---|---|
| Publicado por | JEDEC |
| Tipo de Documento | Norma |
| ICS | 35.220.01 : Dispositivos para almacenamiento de datos en general
|
| Número de páginas | 12 |
| Reemplaza | JEDEC JESD22-A103E:2015 |
