| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Inglés |
Vigente |
1/8/2018 |
77,00 € |
|
||
Detalles
JEDEC JEP131C applies to electronic components and subassemblies product and or process development, manufacturing processes and the associated performance requirements in customer applications. These areas should include, but are not limited to: package design, chip design, process development, assembly, fabrication, manufacturing, materials, quality, service, and suppliers, as well as the process requirements needed for the next assembly.
Información adicional
| Autor | JEDEC Solid State Technology Association |
|---|---|
| Publicado por | JEDEC |
| Tipo de Documento | Norma |
| Tema | /subgroups/36080 |
| Número de páginas | 28 |
| Reemplaza | JEDEC JEP131B,JEDEC JEP131A |
| Palabra clave | JEDEC JEP131C |
