| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
Papel |
Inglés |
Disponible |
1/2/2011 |
213,33 € |
|
||
Detalles
This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This is a must-have reference for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing.
Información adicional
| Autor | Karen A. Reinhardt , Richard F. Reidy |
|---|---|
| Publicado por | WILEY |
| Tipo de Documento | Libro |
| EAN ISBN | 978-0-470-62595-8 |
| Número de páginas | 590 |
| Peso(kg.) | 1.1030 |
