| Nombre | apoyo | Revisión | Disponibilidad | Fecha de emisión | Precio | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Inglés |
Vigente |
1/1/2018 |
181,00 € |
|
||
Detalles
ESD SP5.3.3-2018 establishes the procedure for testing devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined contact CDM electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, optoelectronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices can be characterized according to this standard practice.
Información adicional
| Autor | EOS/ESD Association, Inc. |
|---|---|
| Publicado por | ESD |
| Tipo de Documento | Norma |
| Número de páginas | 28 |
| Palabra clave | ESD SP5.3.3-2018 |
| ANSI Approved |
