| Name | Unterstützung | Language | Verfügbarkeit | Datum der Ausstellung | Preis | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Englisch |
gültig |
01.05.2021 |
62,00 € |
|
||
Details
The purpose of this test method is to evaluate the reliability of nonhermetic packaged solid state devices in humid environments. It employs severe conditions of temperature, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. This is a minor editorial edit to JESD22A110E, July 2015 approved by the formulating committee.
Zusätzliche Information
| Autor | JEDEC Solid State Technology Association |
|---|---|
| Veröffentlicht von | JEDEC |
| Document type | Normen |
| ICS | 17.200.01 : Thermodynamik im Allgemeinen
|
| Ersetzt | JEDECJESD22-A110E:2015 |
