JEDEC JEP170:2013

JEDEC JEP170:2013

Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)

63,00 €

Details

This publication provides description of defects observed in FCxGA components that can adversely impact end-user products and/or applications. It will also provide illustration on other defects that may be considered visual nonconformities since they should be less disruptive of quality or reliability to customer products. Finally, it will depict a method for visual inspection that can be utilized to identify these defects or visual nonconformities and guidance for disposition. Official criteria for product acceptance should be in actual product drawings and specifications.

Zusätzliche Information

Autor JEDEC Solid State Technology Association
Veröffentlicht von JEDEC
Document type Normen
Thema /subgroups/36943
Seitenzahl 18
Schlagwort JEDEC JEP170