JEDEC JEP154:2008

JEDEC JEP154:2008

GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS

81,00 €

Details

This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.

Zusätzliche Information

Autor JEDEC Solid State Technology Association
Veröffentlicht von JEDEC
Document type Normen
Thema /subgroups/36080
Seitenzahl 34
Schlagwort JEDEC JEP154