Name | Unterstützung | Language | Verfügbarkeit | Datum der Ausstellung | Preis | ||
---|---|---|---|---|---|---|---|
PDF |
Englisch |
gültig |
01.01.2008 |
81,00 € |
|
Details
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.
Zusätzliche Information
Autor | JEDEC Solid State Technology Association |
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Veröffentlicht von | JEDEC |
Document type | Normen |
Thema | /subgroups/36080 |
Seitenzahl | 34 |
Schlagwort | JEDEC JEP154 |