Name | Unterstützung | Language | Verfügbarkeit | Datum der Ausstellung | Preis | ||
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Paper |
Englisch |
gültig |
01.08.2022 |
255,00 € |
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PDF sécurisé |
Englisch |
gültig |
01.08.2022 |
195,00 € |
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Details
This standard provides requirements for process control of conveyorized solder reflow ovens. It includes a methodology for performing temperature measurements over time to establish a baseline profile, and then provides requirements to verify repeatability through periodic verification of the oven profile. This standard is not intended for the assembly product profile/recipe. For detailed information on development or veri?cation of a product pro?le/recipe, see IPC-7530.This standard does not address vapor phase processes. Batch ovens offer lower throughput and are also not covered in this standard.
Zusätzliche Information
Autor | Association Connecting Electronics Industries (IPC) |
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Veröffentlicht von | IPC |
Document type | Normen |
Thema | /subgroups/55723 |
Seitenzahl | 20 |
Ersetzt | IPC 7801 |
Gewicht(kg.) | 0.1340 |
Schlagwort | IPC 7801A |