31.180 : Gedruckte Schaltungen und Leiterplatten
-
DIN EN IEC 62878-2-603:2026-03
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 62878-2-603:2025), German version EN IEC 62878-2-603:2025
01.03.2026 - PDF - Deutsche - DIN
mehr dazu91,03 € -
DIN EN IEC 63516:2026-03
Fixed folding durability test method for flexible opto-electric circuit boards (IEC 91/2046/CDV:2025), German and English version prEN IEC 63516:2025
01.03.2026 - PDF - Englisch, Deutsch - DIN
mehr dazu98,32 € -
DIN EN IEC 61249-2-52:2026-02
Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-52:2025), German version EN IEC 61249-2-52:2025
01.02.2026 - PDF - Deutsche - DIN
mehr dazu105,42 € -
DIN EN IEC 61249-2-53:2026-02
Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 91/1978/CDV:2024), German and English version prEN IEC 61249-2-53:2024
01.02.2026 - PDF - Englisch, Deutsch - DIN
mehr dazu105,42 € -
26/30511576 DC:2026
BS EN IEC 63609-3 Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements Part 3: Determination for temperature measurement in using thermocouples
09.01.2026 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
26/30539935 DC:2025
BS EN IEC 63203-302-1 Wearable electronic devices and technologies Part 302-1: Materials - Test method for torsion of conductive stretchable films
26.12.2025 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
CWA 18311:2025
Ermöglichung von Praktiken der Kreislaufwirtschaft: Reparatur und Recycling von Leiterplatten
04.12.2025 - PDF - Englisch - NBN
mehr dazu163,00 € -
BS EN IEC 61249-2-53:2025
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad — PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
02.12.2025 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
BS EN IEC 61189-3-302:2025
Test methods for electrical materials, printed boards and other interconnection structures assemblies Detection of plating defects in unpopulated circuit by computed tomography (CT)
02.12.2025 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
25/30511698 DC:2025
Draft BS EN 61189-5-501 Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 5-501: General test materials - Surface insulation resistance (SIR) testing of solder fluxes
13.11.2025 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
BS EN IEC 61249-2-52:2025
Materials for printed boards and other interconnecting structures Part 2-52: Reinforced base materials clad unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
11.11.2025 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
NF EN IEC 61189-3-302, C93-733-302 (11/2025)
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 3-302: Détection des défauts de métallisation dans les cartes de circuits imprimés nus par tomographie informatisée (TI)
01.11.2025 - PDF - Französisch - AFNOR
mehr dazu74,00 € -
NF EN IEC 61249-2-53, C93-780-2-53 (11/2025)
Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-53 : Matériaux de base renforcés, métallisés et non métallisés - Feuilles stratifiées non chargées en PTFE d’inflammabilité définie (essai de combustion verticale), plaquées cuivre
01.11.2025 - PDF - Französisch - AFNOR
mehr dazu82,00 € -
DIN EN IEC 61189-2-809:2025-11
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (IEC 61189-2-809:2024), German version EN IEC 61189-2-809:2025
01.11.2025 - PDF - Deutsche - DIN
mehr dazu77,20 € -
DIN EN IEC 61189-3-302:2025-11
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024), German and English version prEN IEC 61189-3-302:2024
01.11.2025 - PDF - Englisch, Deutsch - DIN
mehr dazu105,42 € -
PR NF EN IEC 61249-2-54 (11/2025)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-54: Matériaux de base renforcés, plaqués et non plaqués - Système de résine halogénée modifiée ou non modifiée, feuilles stratifiées en tissu de verre E de facteur de dissipation (inférieur à 0,005 à 10 GHz) et inflammabilité définis (essai de combustion verticale), plaquées cuivre pour applications à grande vitesse
01.11.2025 - PDF - Französisch - AFNOR
mehr dazu70,00 € -
IEC 61189-3-302:2025
IEC 61189-3-302:2025 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
22.10.2025 - - - IEC
mehr dazu133,00 € -
IEC 61249-2-53:2025
IEC 61249-2-53:2025 Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
10.10.2025 - - - IEC
mehr dazu133,00 € -
IEC 61249-2-52:2025
IEC 61249-2-52:2025 Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
16.09.2025 - - - IEC
mehr dazu186,00 € -
PR NF EN IEC 63516, C93-738PR (09/2025)
Méthode d’essai de durabilité au pliage fixe pour les circuits optoélectriques souples
01.09.2025 - PDF - Französisch - AFNOR
mehr dazu61,00 € -
DIN EN IEC 61189-2-808:2025-08
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 61189-2-808:2024), German version EN IEC 61189-2-808:2024
01.08.2025 - PDF - Deutsche - DIN
mehr dazu105,42 € -
DIN EN IEC 61189-2-805:2025-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (IEC 61189-2-805:2024), German version EN IEC 61189-2-805:2024
01.08.2025 - PDF - Deutsche - DIN
mehr dazu77,20 € -
BS IEC 62899-203-2:2025
Printed electronics Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
24.06.2025 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
IEC 62899-203-2:2025
IEC 62899-203-2:2025 Printed electronics - Part 203-2: Materials - Semiconductor ink - Space charge limited mobility measurement in printed organic semiconductive layers
19.06.2025 - PDF - Englisch - IEC
mehr dazu133,00 € -
BS IEC 62899-402-1:2025 + Redline
Tracked Changes. Printed electronics Printability. Measurement of qualities. Line pattern widths
30.05.2025 - PDF DRM - Englisch - BSI
mehr dazu443,00 € -
BS IEC 62899-401:2025 + Redline
Tracked Changes. Printed electronics Printability. Overview
30.05.2025 - PDF DRM - Englisch - BSI
mehr dazu271,00 € -
193,00 € -
BS IEC 62899-402-1:2025
Printed electronics Printability. Measurement of qualities. Line pattern widths
13.05.2025 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
IEC 62899-402-1:2025
IEC 62899-402-1:2025 Printed electronics - Part 402-1: Printability - Measurement of qualities - Line pattern widths
09.05.2025 - PDF - Englisch - IEC
mehr dazu93,00 € -
IEC 62899-401:2025
IEC 62899-401:2025 Printed electronics - Part 401: Printability - Overview
05.05.2025 - - - IEC
mehr dazuVon: 46,00 € -
PR NF EN IEC 61249-3-6, C93-770-3-6PR (05/2025)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 3-6: Collection de spécifications intermédiaires pour matériaux de base non renforcés, métallisés et non métallisés - Feuilles stratifiées en PTFE avec charges d'inflammabilité (essai de combustion verticale), plaquées cuivre
01.05.2025 - PDF - Englisch, Französisch - AFNOR
mehr dazu87,00 € -
BS IEC 62899-202-11:2025
Printed electronics Materials. Conductive ink. Measurement method of electrical resistance uniformity for large area printed conductive layer
30.04.2025 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
IEC 62899-202-11:2025
IEC 62899-202-11:2025 Printed electronics - Part 202-11: Materials - Conductive ink - Measurement method of electrical resistance uniformity for large area printed conductive layer
23.04.2025 - PDF - Englisch - IEC
mehr dazu93,00 € -
BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
16.04.2025 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
NF EN IEC 62878-2-603, C93-778-2-603 (04/2025)
Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-603 : lignes directrices pour un empilement de modules électroniques - Méthode d'essai de la connectivité électrique entre modules
01.04.2025 - PDF - Französisch - AFNOR
mehr dazu86,50 € -
PD IEC TR 62899-250:2025 + Redline
Tracked Changes. Printed electronics Material technologies required in printed for wearable smart devices
25.03.2025 - PDF DRM - Englisch - BSI
mehr dazu271,00 € -
PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed for wearable smart devices
17.03.2025 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
IEC TR 62899-250:2025
IEC TR 62899-250:2025 Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
05.03.2025 - PDF - Englisch - IEC
mehr dazu133,00 € -
25/30510920 DC:2025
Draft BS EN 62899-202-12 Ed.1.0 Printed electronics : Materials. Rheological property measurement methods of inkjet ink for printed electronics
25.02.2025 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
IEC 62878-2-603:2025
IEC 62878-2-603:2025 Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
25.02.2025 - PDF - Englisch, Französisch - IEC
mehr dazu93,00 € -
IEC 60194-2:2025
IEC 60194-2:2025 Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies
12.02.2025 - PDF - Englisch - IEC
mehr dazu342,00 € -
BS EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for through hole components (THT)
04.02.2025 - PDF DRM - Englisch - BSI
mehr dazu316,00 € -
BS EN IEC 61189-2-809:2025
Test methods for electrical materials, circuit boards and other interconnection structures assemblies X/Y coefficient of thermal expansion (CTE) test thick base materials by TMA
04.02.2025 - PDF DRM - Englisch - BSI
mehr dazu165,00 € -
25/30508747 DC:2025
BS EN IEC 61189-3-720 Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 3-720: (circuit boards) - Transmission loss test method high frequency multilayer circuit
10.01.2025 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
DIN EN IEC 61189-2-720:2025-01
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024), German version EN IEC 61189-2-720:2024
01.01.2025 - PDF - Deutsche - DIN
mehr dazu77,20 € -
NF EN IEC 61188-6-3, C93-711-6-3 (01/2025)
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-3 : conception de la zone de report - Description de la zone de report pour les composants à trous traversants (THT)
01.01.2025 - PDF - Französisch - AFNOR
mehr dazu126,00 € -
NF EN IEC 61189-2-809, C93-732-809 (01/2025)
Méthodes d'essai pour les matériaux électriques, les circuits imprimés et autres structures d'interconnexion et ensembles - Partie 2-809 : essai du coefficient de dilatation thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)
01.01.2025 - PDF - Französisch - AFNOR
mehr dazu77,67 € -
25/30507775 DC:2024
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
20.12.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
24/30506691 DC:2024
BS IEC 62899-202-13 Printed electronics Part 202-13: Materials - Resistance measurement method for conductive layer in printed and in-mould
13.12.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
IEC 61189-2-809:2024
IEC 61189-2-809:2024 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
09.12.2024 - PDF - Englisch, Französisch - IEC
mehr dazu46,00 € -
IEC 61188-6-3:2024
IEC 61188-6-3:2024 Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
09.12.2024 - PDF - Englisch, Französisch - IEC
mehr dazu302,00 € -
117,00 € -
145,00 €
-
ISO/DIS 13060:2024
An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
02.11.2024 - PDF - Englisch - ISO
mehr dazu77,00 € -
DIN EN IEC 61189-2-804:2024-10
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023), German version EN IEC 61189-2-804:2023
01.10.2024 - PDF - Deutsche - DIN
mehr dazu63,27 € -
24/30499551 DC:2024
BS EN IEC 63516 Fixed folding durability test method for flexible opto-electric circuit boards
23.08.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
24/30499026 DC:2024
BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad high speed applications
16.08.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
24/30477141 DC:2024
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
09.08.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
DIN EN IEC 61189-2-801:2024-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023), German version EN IEC 61189-2-801:2023
01.08.2024 - PDF - Deutsche - DIN
mehr dazu77,20 € -
DIN EN IEC 61189-2-803:2024-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023), German version EN IEC 61189-2-803:2023
01.08.2024 - PDF - Deutsche - DIN
mehr dazu63,27 € -
BS EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures assemblies Thermal resistance of an assembly by thermal transient method
04.06.2024 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
BS EN IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures assemblies X/Y CTE test thin base materials by TMA
30.05.2024 - PDF DRM - Englisch - BSI
mehr dazu165,00 € -
24/30493202 DC:2024
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility Basic patterns printing plate
10.05.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
BS EN IEC 63203-301-1:2024
Wearable electronic devices and technologies Test method of electrochromic films for wearable equipment
09.05.2024 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
NF EN IEC 61189-2-805, C93-732-805 (05/2024)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-805 : essai à faible CDT X/Y par TMA pour matériaux de base minces
01.05.2024 - PDF - Französisch - AFNOR
mehr dazu77,67 € -
NF EN IEC 61189-2-808, C93-732-808 (05/2024)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures et assemblages d'interconnexion - Partie 2-808 : résistance thermique d'un assemblage par la méthode du transitoire thermique
01.05.2024 - PDF - Französisch - AFNOR
mehr dazu111,67 € -
IEC 61189-2-808:2024
IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
25.04.2024 - PDF - Englisch, Französisch - IEC
mehr dazu133,00 € -
IEC 61189-2-805:2024
IEC 61189-2-805:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
18.04.2024 - PDF - Englisch, Französisch - IEC
mehr dazu46,00 € -
BS EN IEC 61189-2-720:2024
Test methods for electrical materials, circuit boards and other interconnection structures assemblies Detection of defects in by measurement capacitance
17.04.2024 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
24/30491435 DC:2024
BS IEC 62899-402-2 Printed electronics Part 402-2: Printability - Measurement of qualities Edge waviness printed pattern using a two-dimensional optical image
12.04.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
24/30491008 DC:2024
BS EN IEC 61249-3-6. Materials for printed boards and other interconnecting structures Part 3-6. Sectional specification set unreinforced base materials, clad unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
10.04.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
NF EN IEC 61189-2-720, C93-732-720 (04/2024)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-720 : détection de défauts présents dans les structures d'interconnexion par mesurage de la capacité
01.04.2024 - PDF - Französisch - AFNOR
mehr dazu70,50 € -
BS EN IEC 63203-402-2:2024
Wearable electronic devices and technologies Performance measurement of fitness wearables. Step counting
19.03.2024 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
BS IEC 62899-202-8:2024
Printed electronics Materials. Conductive ink. Measurement of difference in resistance printing direction conductive film fabricated with wire-shaped materials
19.03.2024 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
IEC 62899-202-8:2024
IEC 62899-202-8:2024 Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
15.03.2024 - PDF - Englisch - IEC
mehr dazu93,00 € -
24/30488910 DC:2024
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
11.03.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
IEC 61189-2-720:2024
IEC 61189-2-720:2024 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
06.03.2024 - PDF - Englisch, Französisch - IEC
mehr dazu46,00 € -
PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
07.02.2024 - PDF DRM - Englisch - BSI
mehr dazu165,00 € -
DIN EN IEC 61249-2-51:2024-02
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023), German version EN IEC 61249-2-51:2023
01.02.2024 - PDF - Deutsche - DIN
mehr dazu98,32 € -
IEC TS 62878-2-10:2024
IEC TS 62878-2-10:2024 Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
31.01.2024 - PDF - Englisch - IEC
mehr dazu46,00 € -
24/30485597 DC:2024
BS IEC 62899-402-8. Printed electronics Part 402-8. Printability. Measurement of qualities. Shape pattern dimension
09.01.2024 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
BS EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures assemblies Thermal conductivity test base materials
25.12.2023 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
BS EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures assemblies time to delamination. T260, T288, T300
25.12.2023 - PDF DRM - Englisch - BSI
mehr dazu165,00 € -
BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
19.12.2023 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
NF EN IEC 63251, C93-737 (12/2023)
Méthode d'essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermique
01.12.2023 - PDF - Französisch - AFNOR
mehr dazu111,67 € -
DIN EN IEC 61189-2-501:2023-12
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022), German version EN IEC 61189-2-501:2022
01.12.2023 - PDF - Deutsche - DIN
mehr dazu98,32 € -
23/30450091 DC:2023
BS IEC 62899-203-2 Printed electronics Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
01.12.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
BS EN IEC 63203-401-1:2023
Wearable electronic devices and technologies Devices systems: functional elements. Evaluation method of the stretchable resistive strain sensor
30.11.2023 - PDF DRM - Englisch - BSI
mehr dazu355,00 € -
23/30483578 DC:2023
BS IEC 62899-202-11. Printed electronics Part 202-11. Materials. Conductive ink. Measurement method of electrical resistance uniformity for large area printed conductive layer
23.11.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
404,00 € -
UNE-EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (Endorsed by Asociación Española de Normalización in November of 2023.)
03.11.2023 - PDF - Englisch - AENOR
mehr dazu57,00 € -
IEC 63251:2023
IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
01.11.2023 - PDF - Englisch, Französisch - IEC
mehr dazu186,00 € -
BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. patterns for mechanical test
26.10.2023 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
23/30436874 DC:2023
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
23.10.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
IEC 63055:2023
IEC 63055:2023 Format for LSI-Package-Board Interoperable design
11.10.2023 - PDF - Englisch - IEC
mehr dazu551,00 € -
UNE-EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)
06.10.2023 - PDF - Englisch - AENOR
mehr dazu59,00 € -
UNE-EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (Endorsed by Asociación Española de Normalización in October of 2023.)
06.10.2023 - PDF - Englisch - AENOR
mehr dazu57,00 € -
NF EN IEC 61189-2-804, C93-732-804 (10/2023)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804 : méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300
01.10.2023 - PDF - Französisch - AFNOR
mehr dazu77,67 € -
UNE-EN IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (Endorsed by Asociación Española de Normalización in September of 2023.)
18.09.2023 - PDF - Englisch - AENOR
mehr dazu68,00 € -
BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures assemblies Z-axis expansion of base materials
13.09.2023 - PDF DRM - Englisch - BSI
mehr dazu165,00 € -
23/30479769 DC:2023
BS EN IEC 61249-2-52 Materials for printed boards and other interconnecting structures Part 2-52. Reinforced base materials clad unclad. Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
12.09.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
BS EN IEC 61249-6-3:2023 + Redline
Tracked Changes. Materials for printed boards and other interconnecting structures Sectional specification set reinforcement materials. Specification finished fabric woven from "E" glass
06.09.2023 - PDF - Englisch - BSI
mehr dazu326,00 € -
NF EN IEC 61189-2-801, C93-732-801 (09/2023)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-801 : essai de conductivité thermique pour matériaux de base
01.09.2023 - PDF - Französisch - AFNOR
mehr dazu77,67 € -
NF EN IEC 61189-2-803, C93-732-803 (09/2023)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803 : méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
01.09.2023 - PDF - Französisch - AFNOR
mehr dazu77,67 € -
IEC 61189-2-804:2023
IEC 61189-2-804:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
25.08.2023 - PDF - Englisch, Französisch - IEC
mehr dazu23,00 € -
BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
23.08.2023 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
IEC 62899-202-10:2023
IEC 62899-202-10:2023 Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
16.08.2023 - PDF - Englisch - IEC
mehr dazu244,00 € -
BS EN IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures Sectional specification set reinforcement materials. Specification finished fabric woven from "E" glass
08.08.2023 - PDF - Englisch - BSI
mehr dazu250,00 € -
IEC 62899-202-9:2023
IEC 62899-202-9:2023 Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
03.08.2023 - PDF - Englisch - IEC
mehr dazu93,00 € -
23/30477815 DC:2023
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation printed
02.08.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
NF EN IEC 61249-6-3, C93-780-6-3 (08/2023)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 6-3 : ensemble de spécifications intermédiaires pour matériaux de renfort - Spécification des tissus finis en verre "E" pour circuits imprimés
01.08.2023 - PDF - Französisch - AFNOR
mehr dazu111,67 € -
UNE-EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)
26.07.2023 - PDF - Englisch - AENOR
mehr dazu65,00 € -
IEC 61189-2-801:2023
IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
26.07.2023 - PDF - Englisch, Französisch - IEC
mehr dazu46,00 € -
IEC 61189-2-803:2023
IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
26.07.2023 - PDF - Englisch, Französisch - IEC
mehr dazu23,00 € -
BS EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Base materials integrated circuit card carrier tape, unclad
22.06.2023 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
CWA 18002:2023
Best Practices für die Hybridisierung und das Spritzgießen von starren Steuergeräten auf flexiblen In-Mold-Geräten
22.06.2023 - PDF - Englisch - NBN
mehr dazu121,00 € -
PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit for use in automotive applications. Best practices
19.06.2023 - PDF DRM - Englisch - BSI
mehr dazu404,00 € -
IEC 61249-6-3:2023
IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
14.06.2023 - PDF - Englisch, Französisch - IEC
mehr dazu186,00 € -
BS IEC 62899-202:2023 + Redline
Tracked Changes. Printed electronics Materials. Conductive ink
08.06.2023 - PDF DRM - Englisch - BSI
mehr dazu443,00 € -
IEC TR 61191-9:2023
IEC TR 61191-9:2023 Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
07.06.2023 - PDF - Englisch - IEC
mehr dazu441,00 € -
23/30474639 DC:2023
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
02.06.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
NF EN IEC 61249-2-51, C93-780-2-51 (06/2023)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-51 : matériaux de base renforcés, plaqués et non plaqués - Matériaux de base pour bande support de carte à circuit intégré, non plaqués
01.06.2023 - PDF - Französisch - AFNOR
mehr dazu95,67 € -
IEEE 2716:2022
IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
29.05.2023 - PDF - Englisch - IEEE
mehr dazu68,00 € -
IEEE 2716:2022
IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
29.05.2023 - Papier - Englisch - IEEE
mehr dazu85,00 € -
23/30473810 DC:2023
BS IEC 63240-1. Active assisted living (AAL) reference architecture and model Part 1. Reference
26.05.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
23/30474274 DC:2023
BS EN IEC 63267-3-81. Fibre optic interconnecting devices and passive components. Connector optical interfaces for enhanced Macro bend multimode fibre Part 3-81. parameters of physically contacting 50 µm core diameter fibres. Non-angled polyphenylene sulphide rectangular ferrules with a single row 12, 8, 4, or 2 fibres reference connector applications
26.05.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
23/30474278 DC:2023
BS EN IEC 63267-3-61. Fibre optic interconnecting devices and passive components. connector optical interfaces for enhanced macrobend multimode fibres Part 3-61. Connector parameters of physically contacting 50 µm core diameter fibres. Non-angled 2,5 mm 1,25 cylindrical full zirconia ferrules reference connection applications
26.05.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
316,00 € -
IEC 61249-2-51:2023
IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
11.05.2023 - PDF - Englisch, Französisch - IEC
mehr dazu133,00 € -
IEC 62899-202:2023
IEC 62899-202:2023 Printed electronics - Part 202: Materials - Conductive ink
02.05.2023 - - - IEC
mehr dazuVon: 302,00 € -
DIN EN IEC 61188-6-2:2023-03
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021), German version EN IEC 61188-6-2:2021
01.03.2023 - PDF - Deutsche - DIN
mehr dazu116,64 € -
BS EN IEC 63203-801-1:2022
Wearable electronic devices and technologies Smart body area network (SmartBAN). Enhanced ultra-low power physical layer
07.02.2023 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility for flexible opto-electric circuits
26.01.2023 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
BS EN IEC 63203-402-1:2022
Wearable electronic devices and technologies Performance measurement of fitness wearables. Test methods glove-type motion sensors for measuring finger movements
20.01.2023 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
23/30445197 DC:2023
BS EN 62899-401. Printed electronics Part 401. Printability. Overview
16.01.2023 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
DIN EN IEC 61189-2-807:2023-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021), German version EN IEC 61189-2-807:2021
01.01.2023 - PDF - Deutsche - DIN
mehr dazu77,20 € -
DIN EN IEC 61189-5-601:2022-12
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021), German version EN IEC 61189-5-601:2021
01.12.2022 - PDF - Deutsche - DIN
mehr dazu140,00 € -
UNE-EN IEC 62496-2-5:2023
Optical circuit boards - Basic test and measurement procedures - Part 2-5: Flexibility test for flexible opto-electric circuits (Endorsed by Asociación Española de Normalización in March of 2023.)
12.10.2022 - PDF - Englisch - AENOR
mehr dazu69,00 € -
PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic
13.09.2022 - PDF DRM - Englisch - BSI
mehr dazu404,00 € -
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
23.08.2022 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
DIN EN IEC 61189-5-301:2022-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (IEC 61189-5-301:2021), German version EN IEC 61189-5-301:2021
01.08.2022 - PDF - Deutsche - DIN
mehr dazu128,22 € -
DIN EN IEC 61189-5-501:2022-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:2021), German version EN IEC 61189-5-501:2021
01.08.2022 - PDF - Deutsche - DIN
mehr dazu111,40 € -
DIN EN IEC 62878-2-602:2022-08
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021), German version EN IEC 62878-2-602:2021
01.08.2022 - PDF - Deutsche - DIN
mehr dazu84,58 € -
DIN EN IEC 61188-6-1:2022-08
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021), German version EN IEC 61188-6-1:2021.
01.08.2022 - PDF - Deutsche - DIN
mehr dazu122,34 € -
IEC PAS 61191-10:2022
IEC PAS 61191-10:2022 Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
18.07.2022 - PDF - Englisch - IEC
mehr dazu551,00 € -
BS EN IEC 63203-406-1:2022
Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable while in contact with human skin (IEC 63203-406-1:2021)
10.05.2022 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
BS EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Measurement of resilience strength retention factor flexible dielectric
06.05.2022 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
DIN EN IEC 61189-5-502:2022-05
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021), German version EN IEC 61189-5-502:2021
01.05.2022 - PDF - Deutsche - DIN
mehr dazu111,40 € -
IEC TR 62878-2-9:2022
IEC TR 62878-2-9:2022 Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
27.04.2022 - PDF - Englisch - IEC
mehr dazu93,00 € -
BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
06.04.2022 - PDF DRM - Englisch - BSI
mehr dazu165,00 € -
DIN EN IEC 61188-6-3:2022-04
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021), Text in German and English
01.04.2022 - PDF - Englisch, Deutsch - DIN
mehr dazu105,42 € -
UNE-EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (Endorsed by Asociación Española de Normalización in April of 2022.)
01.04.2022 - PDF - Englisch - AENOR
mehr dazu65,00 € -
ASTM D3380-22
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
15.03.2022 - PDF DRM non imprimable - Englisch - ASTM
mehr dazu72,00 € -
ASTM D3380-22 + Redline
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
15.03.2022 - PDF DRM non imprimable - Englisch - ASTM
mehr dazu86,00 € -
NF EN IEC 61189-2-501, C93-732-501 (03/2022)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-501 : méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la puissance élastique et du facteur de rétention de la puissance élastique des matériaux diélectriques flexibles
01.03.2022 - PDF - Französisch - AFNOR
mehr dazu95,67 € -
IEC 61189-2-501:2022
IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
03.02.2022 - PDF - Englisch, Französisch - IEC
mehr dazu93,00 € -
BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
24.12.2021 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
21/30432230 DC:2021
BS EN IEC 63203-402-3. Wearable electronic devices and technologies Part 402-3. Performance measurement method of wearables. Series 2: Accuracy Heart Rate Determination
19.11.2021 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
21/30447898 DC:2021
BS EN IEC 63203-402-2. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting
19.11.2021 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Decomposition temperature (Td) using TGA
05.11.2021 - PDF DRM - Englisch - BSI
mehr dazu165,00 € -
UNE-EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
01.11.2021 - PDF - Englisch - AENOR
mehr dazu60,00 € -
PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
29.10.2021 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
21/30446636 DC:2021
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
29.10.2021 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
IEC 62899-202-4:2021
IEC 62899-202-4:2021 Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
22.10.2021 - PDF - Englisch - IEC
mehr dazu186,00 € -
IEC 62899-201-2:2021
IEC 62899-201-2:2021 Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
14.10.2021 - PDF - Englisch - IEC
mehr dazu46,00 € -
DIN EN IEC 62878-1:2021-10
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019), German version EN IEC 62878-1:2019
01.10.2021 - PDF - Deutsche - DIN
mehr dazu105,42 € -
UNE-EN IEC 62878-2-602:2021
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
01.10.2021 - PDF - Englisch - AENOR
mehr dazu63,00 € -
NF EN IEC 61189-2-807, C93-732-807 (10/2021)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807 : Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA
01.10.2021 - PDF - Französisch - AFNOR
mehr dazu77,67 € -
IEC TR 62899-402-4:2021
IEC TR 62899-402-4:2021 Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
21.09.2021 - PDF - Englisch - IEC
mehr dazu133,00 € -
IEC 61189-2-807:2021
IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
03.09.2021 - PDF - Englisch, Französisch - IEC
mehr dazu46,00 € -
DIN EN IEC 61189-5-504:2021-09
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020), German version EN IEC 61189-5-504:2020
01.09.2021 - PDF - Deutsche - DIN
mehr dazu111,40 € -
BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
20.08.2021 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
NF EN IEC 62878-2-602, C93-778-2-602 (08/2021)
Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-602 : lignes directrices pour un empilement de modules électroniques - Méthode d'évaluation de la connectivité électrique entre modules
01.08.2021 - PDF - Französisch - AFNOR
mehr dazu95,67 € -
21/30441791 DC:2021
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-809. X/Y Coefficient of Thermal Expansion (CTE) Thick Base Materials by TMA
30.07.2021 - PDF DRM - Englisch - BSI
mehr dazu23,00 € -
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
29.07.2021 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
IEC TR 62878-2-8:2021
IEC TR 62878-2-8:2021 Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
07.07.2021 - PDF - Englisch - IEC
mehr dazu93,00 € -
IEC 62878-2-602:2021
IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
22.06.2021 - PDF - Englisch, Französisch - IEC
mehr dazu93,00 € -
NF EN IEC 61189-5-502, C93-735-502 (06/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502 : General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-502 : Méthodes d'essai générales pour les matériaux et les ensembles - Essai de résistance d'isolement de surface (SIR) des ensembles.
01.06.2021 - PDF - Französisch - AFNOR
mehr dazu111,67 € -
NF EN IEC 61189-5-601, C93-735-601 (06/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601 : general test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-601 : méthodes d'essai générales pour les matériaux et les assemblages - Essai d'aptitude au brasage par refusion pour un joint brasé, et essai de résistance
01.06.2021 - PDF - Französisch - AFNOR
mehr dazu138,00 € -
UNE-EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Española de Normalización in June of 2021.)
01.06.2021 - PDF - Englisch - AENOR
mehr dazu75,00 € -
BS EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Soldering paste using fine solder particles
06.05.2021 - PDF DRM - Englisch - BSI
mehr dazu316,00 € -
UNE-EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
01.05.2021 - PDF - Englisch - AENOR
mehr dazu75,00 € -
BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
22.04.2021 - PDF DRM - Englisch - BSI
mehr dazu193,00 € -
BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on
07.04.2021 - PDF DRM - Englisch - BSI
mehr dazu316,00 € -
IEC 62899-402-3:2021
IEC 62899-402-3:2021 Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image
07.04.2021 - PDF - Englisch - IEC
mehr dazu133,00 € -
NF EN IEC 61188-6-1, C93-711-6-1 (04/2021)
Circuit boards and circuit board assemblies - Design and use - Part 6-1 : land pattern design - Generic requirements for land pattern on circuit boards - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-1 : Conception de la zone de report - Exigences génériques pour la zone de report sur les cartes à circuit imprimé
01.04.2021 - PDF - Französisch - AFNOR
mehr dazu126,00 € -
NF EN IEC 61189-5-301, C93-735-301 (04/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301 : general test methods for materials and assemblies - Soldering paste using fine solder particles - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-301 : Méthodes d'essai pour les cartes imprimées équipées - Pâte à braser à fines particules de brasage.
01.04.2021 - PDF - Französisch - AFNOR
mehr dazu126,00 € -
DIN EN IEC 62878-2-5:2021-04
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019), German version EN IEC 62878-2-5:2019
01.04.2021 - PDF - Deutsche - DIN
mehr dazu157,10 € -
UNE-EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)
01.04.2021 - PDF - Englisch - AENOR
mehr dazu69,00 € -
UNE-EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
01.04.2021 - PDF - Englisch - AENOR
mehr dazu72,00 € -
UNE-EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (Endorsed by Asociación Española de Normalización in April of 2021.)
01.04.2021 - PDF - Englisch - AENOR
mehr dazu71,00 € -
UNE-EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)
01.04.2021 - PDF - Englisch - AENOR
mehr dazu83,00 € -
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices
25.03.2021 - PDF DRM - Englisch - BSI
mehr dazu316,00 € -
BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Reflow soldering ability solder joint, reflow heat resistance
19.03.2021 - PDF DRM - Englisch - BSI
mehr dazu355,00 € -
BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
19.03.2021 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
IEC TR 61191-8:2021
IEC TR 61191-8:2021 Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
19.03.2021 - PDF - Englisch - IEC
mehr dazu302,00 € -
BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of
18.03.2021 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
IEC 61189-5-301:2021
IEC 61189-5-301:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
17.03.2021 - PDF - Englisch, Französisch - IEC
mehr dazu302,00 € -
BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of solder fluxes
12.03.2021 - PDF DRM - Englisch - BSI
mehr dazu269,00 € -
BS IEC 62899-202-7:2021
Printed electronics Materials. film. Measurement of peel strength for printed layer on flexible substrate by the 90° method
11.03.2021 - PDF DRM - Englisch - BSI
mehr dazu193,00 €
