Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
---|---|---|---|---|---|---|---|
PDF |
Allemand |
Active |
01/03/2021 |
96,13 € |
|
Détails
MID technology enables the integration of mechanical, electrical, electronic, and thermal functions on a spatial circuit carrier. This enables assemblies with a high functional density and a considerable degree of miniaturization. At present, however, there are no generally applicable standards for the manufacture of MIDs that process managers and customers can use as a guideline. This standard provides detailed information on laser direct structuring. It is aimed at users and producers of mechatronically integrated assemblies.
Informations supplémentaires
Auteur | Verein Deutscher Ingenieure (VDI) |
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Edité par | VDI |
Type de document | Norme |
ICS | 31.220.01 : Composants électromécaniques en général
39.020 : Mécanique de précision |
Nombre de pages | 21 |
Remplace | VDI/VDE 3719 Blatt 1 (2019-05) |
Recueil | VDI/VDE-Handbuch Fertigungsmesstechnik,VDI-Handbuch Produktionstechnik und Fertigungsverfahren Band 3 |
Mot-clé | VDI 3719, VDI 3719 Blatt 1, VDI/VDE 3719, 3719 |