| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Anglais |
Active |
01/11/2000 |
19,00 € |
|
||
Détails
Organic flux residues deposited onto the surfaces of flip-chip assemblies during reflow soldering operations have been shown, in some cases, to affect the properties of underfill materials. The results of a series of experiments designed to evaluate the effects of post-reflux cleaning processes on the performance of flip-chip assemblies are reported.
Informations supplémentaires
| Auteur | Society of Manufacturing Engineers |
|---|---|
| Edité par | SME |
| Type de document | Norme |
| Thème | /subgroups/9449 |
| Nombre de pages | 12 |
| Mot-clé | SME MR00-162 |
