| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
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PDF sécurisé |
Anglais |
Active |
01/03/2015 |
360,00 € |
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Détails
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 11, 2014. Available at www.semiviews.org and www.semi.org in March 2015, originally published April 2012, previously published August 2014.
The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process.
This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces.
Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds or cleanliness are not defined.
This Standard specifies both semi-automated (PGV) and automated (AGV or OHT) handling of the tape frame cassette for 450 mm wafer. It does not intend to address manual handling
Informations supplémentaires
| Auteur | Semiconductor Equipment and Materials Institute (SEMI) |
|---|---|
| Edité par | SEMI |
| Type de document | Norme |
| Nombre de pages | 15 |
