| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
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PDF sécurisé |
Anglais |
Active |
01/09/1996 |
204,00 € |
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Détails
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2018. Available at www.semiviews.org and www.semi.org in March 2011, originally published in 1996, previously published August 2011.
The purpose of this Test Method is to determine the thermal resistance of semiconductor packages using thermal test chips. This Test Method deals with junction-to-case measurements of thermal resistance in air environment.
The results of this Test Method are used to obtain the junction temperature.
The measurement results are usually different from the results obtained by testing in the fluid bath environment described in SEMI G30 and SEMI G43.
This Test Method uses SI units.
Informations supplémentaires
| Auteur | Semiconductor Equipment and Materials Institute (SEMI) |
|---|---|
| Edité par | SEMI |
| Type de document | Norme |
| Date de confirmation | 2018-03-01 |
