| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
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PDF sécurisé |
Anglais |
Active |
01/05/2019 |
204,00 € |
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Détails
This specification defines a procedure for measuring the flashing characteristics of semiconductor grade transfer molding compounds.
The flashing tendency for semiconductor grade molding compounds depends on the interaction of several variables, including mold conditions, process parameters, molding compound viscosity, and curing characteristics. This test is not a valid method for predicting the flashing performance in all mold types. It is a method for comparing flash tendency and flashing type of different molding compounds when evaluated under a specific set of molding process parameters.
Flashing presents problems with subsequent processing of plastic packaged devices after molding. A high flashing tendency increases die wear in the trim and form operation, may interfere with plating or solder dip finishing operations, and may prevent good contact for electrical test. Thus, reduced tendency toward flashing will improve the plastic package subassembly operations. The information from this test will be of value in rating flash performance of any given compound to that in production use.
The specification and test methods details in this Document apply to mold resin compounds which is used for packaging.
Informations supplémentaires
| Auteur | Semiconductor Equipment and Materials Institute (SEMI) |
|---|---|
| Edité par | SEMI |
| Type de document | Norme |
