| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
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PDF sécurisé |
Anglais |
Active |
01/12/2013 |
204,00 € |
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Détails
This Standard was technically approved by the Facilities Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 22, 2013. Available at www.semiviews.org and www.semi.org in December 2013, originally published June 1998, previously published November 2003.
This Document will provide an overview of the various elements of Tool Accommodation, a methodology by which semiconductor processing equipment is installed in a cost-effective and timely manner. This addition to the SEMI Tool Accommodation Standards set describes the process by which the referenced SEMI Documents can be effectively used to achieve tool installation cost and schedule goals.
This overview Document will provide process development, facilities, manufacturing, and sales engineers (as well as purchasing agents and managers) with a basic understanding of the various elements in a Tool Accommodation methodology. This process emphasizes quality, completeness, timeliness, and cost-effectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities. By describing a generic process flow, this document identifies a road map for using published standards that comprehend all the procedures involved in tool accommodation from procurement through acceptance. As a common ground for communication and comparison, terms and definitions are also included.
Informations supplémentaires
| Auteur | Semiconductor Equipment and Materials Institute (SEMI) |
|---|---|
| Edité par | SEMI |
| Type de document | Norme |
