Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
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PDF sécurisé |
Anglais |
Active |
01/06/2019 |
204,00 € |
|
Détails
The purpose of this Document is to establish the standard for the adhesive strength test method of adhesive tray used for thin chip handling and shipping.
This Document covers measuring system (system configuration, die pick up tool).
This Document states test method (die mount layout, measurement environment, peeling speed etc.).
Informations supplémentaires
Auteur | Semiconductor Equipment and Materials Institute (SEMI) |
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Edité par | SEMI |
Type de document | Norme |