Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
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PDF |
Anglais |
Active |
01/07/2015 |
58,00 € |
|
Détails
The purpose of this test method is to evaluate the reliability of nonhermetic packaged solid state devices in humid environments. It employs severe conditions of temperature, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it.
Informations supplémentaires
Auteur | JEDEC Solid State Technology Association |
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Edité par | JEDEC |
Type de document | Norme |
Thème | /subgroups/36080 |
Nombre de pages | 14 |
Remplace | JEDEC JESD22-A110D,JEDEC JESD 22-A110C |
Mot-clé | JEDEC JESD22-A110E |