| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Anglais |
Active |
01/07/2015 |
57,00 € |
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Détails
This standard establishes a defined method and conditions for performing a temperature humidity life test with bias applied. The test is used to evaluate the reliability of non-hermetic packaged solid state devices in humid environments. It employs high temperature and humidity conditions to accelerate the penetration of moisture through external protective material or along interfaces between the external protective coating and conductors or other features which pass through it. This revision enhances the ability to perform this test on a device which cannot be biased to achieve very low power dissipation.
Informations supplémentaires
| Auteur | JEDEC Solid State Technology Association |
|---|---|
| Edité par | JEDEC |
| Type de document | Norme |
| Thème | /subgroups/36080 |
| Date annulation | 2021-01-01 |
| ICS | 17.200.01 : Thermodynamique en général
|
| Nombre de pages | 12 |
| Remplace | EIA JESD 22-A101C (2009-03) |
| Remplacé par | JEDEC JESD22-A101D.01:2021 |
| Mot-clé | JEDEC JESD22-A101D |
