| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
|
PDF |
Anglais |
Active |
01/07/2008 |
66,00 € |
|
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Détails
This document specifies the definition and construction of a two-resistor compact thermal model (CTM) from the JEDEC junction-to-case and junction-to-board thermal metrics. The guidance provided in this document only applies to thermal metrics defined in JEDEC standards JESD51-8 and JESD51-12. The scope of this document is limited to single-die packages that can be effectively represented by a single junction temperature.
Informations supplémentaires
| Auteur | JEDEC Solid State Technology Association |
|---|---|
| Edité par | JEDEC |
| Type de document | Norme |
| Thème | /subgroups/36160 |
| Nombre de pages | 21 |
| Mot-clé | JEDEC JESD15-3 |
