| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
|
Papier |
Anglais |
Active |
01/03/2006 |
168,00 € |
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|
PDF sécurisé |
Anglais |
Active |
01/03/2006 |
108,00 € |
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Détails
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It should be noted that for certain applications with special needs (e.g., military or aerospace), the Sn mitigation methods contained in this document may not be sufficient due to additional performance requirements. 26 pages. Released March 2006.
Informations supplémentaires
| Auteur | Association Connecting Electronics Industries (IPC) |
|---|---|
| Edité par | IPC |
| Type de document | Norme |
| Thème | General |
| ICS | 31 : Electronique
|
| Nombre de pages | 32 |
| Poids (kg.) | 0.15 |
| Historique | IPC JP002 (2006-05-02) |
| Mot-clé | JP002 |
