| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
|
Papier |
Anglais |
Active |
01/12/2022 |
168,00 € |
|
||
Détails
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic devices. This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility.
Informations supplémentaires
| Auteur | Association Connecting Electronics Industries (IPC) |
|---|---|
| Edité par | IPC |
| Type de document | Norme |
| Nombre de pages | 26 |
| Remplace | IPC J-STD-035 |
| Poids (kg.) | 0.14 |
| Mot-clé | IPC J-STD-035A |
