| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
|
Papier |
Anglais |
Active |
01/09/2011 |
231,00 € |
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|
PDF sécurisé |
Anglais |
Active |
01/09/2011 |
185,00 € |
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Détails
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.
Informations supplémentaires
| Auteur | Association Connecting Electronics Industries (IPC) |
|---|---|
| Edité par | IPC |
| Type de document | Norme |
| Thème | General |
| ICS | 31 : Electronique
|
| Nombre de pages | 24 |
| Poids (kg.) | 0.14 |
| Mot-clé | IPC 9707 |
