| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
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PDF sécurisé |
Chinois |
Active |
01/03/2009 |
195,00 € |
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Papier |
Anglais |
Active |
01/03/2009 |
231,00 € |
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|
PDF sécurisé |
Anglais |
Active |
01/03/2009 |
185,00 € |
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Détails
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests.
Informations supplémentaires
| Auteur | Association Connecting Electronics Industries (IPC) |
|---|---|
| Edité par | IPC |
| Type de document | Norme |
| Thème | General |
| Edition révision n° | 1 |
| ICS | 31 : Electronique
|
| Nombre de pages | 48 |
| Mot-clé | IPC 9703 |
