IPC 9631:2010

IPC 9631:2010

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

195,00 €

Détails

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment.

Informations supplémentaires

Auteur Association Connecting Electronics Industries (IPC)
Edité par IPC
Type de document Norme
ICS 31 : Electronique
Nombre de pages 24
Mot-clé IPC 9631