Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
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PDF sécurisé |
Anglais |
Active |
01/08/2022 |
195,00 € |
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Papier |
Anglais |
Active |
01/08/2022 |
255,00 € |
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Détails
This standard provides requirements for process control of conveyorized solder reflow ovens. It includes a methodology for performing temperature measurements over time to establish a baseline profile, and then provides requirements to verify repeatability through periodic verification of the oven profile. This standard is not intended for the assembly product profile/recipe. For detailed information on development or veri?cation of a product pro?le/recipe, see IPC-7530.This standard does not address vapor phase processes. Batch ovens offer lower throughput and are also not covered in this standard.
Informations supplémentaires
Auteur | Association Connecting Electronics Industries (IPC) |
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Edité par | IPC |
Type de document | Norme |
Thème | /subgroups/55723 |
Nombre de pages | 20 |
Remplace | IPC 7801 |
Mot-clé | IPC 7801A |