IPC 7091A:2023

IPC 7091A:2023

Design and Assembly Process Implementation of 3D Components

254,00 €

Détails

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.

Informations supplémentaires

Auteur Association Connecting Electronics Industries (IPC)
Edité par IPC
Type de document Norme
Thème /subgroups/19420
EAN ISBN 9781638161134
Nombre de pages 104
Remplace IPC 7091
Poids (kg.) 0.28
Mot-clé IPC 7091A