Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
---|---|---|---|---|---|---|---|
PDF sécurisé |
Anglais |
Active |
01/01/2000 |
144,00 € |
|
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Papier |
Anglais |
Active |
01/01/2000 |
192,00 € |
|
Détails
Recognizing Japan's leadership in microvia substrate production, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC/JPCA-6801. The adoption of this document is a part of the ongoing efforts of the IPC HDI Committee and JPCA Build-Up PWB Committee to ensure global consistency in the terminology, requirements and test methods for HDI and microvia applications. IPC/JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also included is a design criteria table and background information for the development of a standard for HDI PWBs.
Informations supplémentaires
Auteur | Association Connecting Electronics Industries (IPC) |
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Edité par | IPC |
Type de document | Norme |
Thème | PCBs |
Edition révision n° | 1 |
EAN ISBN | 1580982395 |
ICS | 31 : Electronique
|
Nombre de pages | 41 |
Mot-clé | IPC 6801 |