| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
|
Papier |
Anglais |
Active |
01/02/1998 |
168,00 € |
|
||
|
PDF sécurisé |
Anglais |
Active |
01/02/1998 |
108,00 € |
|
||
Détails
This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.
Informations supplémentaires
| Auteur | Association Connecting Electronics Industries (IPC) |
|---|---|
| Edité par | IPC |
| Type de document | Norme |
| Thème | PCBs |
| ICS | 31 : Electronique
|
| Nombre de pages | 25 |
| Poids (kg.) | 0.14 |
| Mot-clé | IPC 6015 |
