Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
---|---|---|---|---|---|---|---|
PDF sécurisé |
Anglais |
Active |
01/09/2021 |
195,00 € |
|
||
PDF sécurisé |
Chinois |
Active |
01/09/2021 |
195,00 € |
|
||
Papier |
Chinois |
Active |
01/09/2021 |
255,00 € |
|
||
Papier |
Anglais |
Active |
01/09/2021 |
255,00 € |
|
Détails
This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes (PTHs), and blind/buried vias. The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.Revision level changes are described in 1.7.
Informations supplémentaires
Auteur | Association Connecting Electronics Industries (IPC) |
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Edité par | IPC |
Type de document | Norme |
Thème | /subgroups/55721 |
EAN ISBN | 9781638160205 |
Nombre de pages | 84 |
Remplace | IPC 6013D,IPC 6013C,IPC 6013B,IPC 6013A |
Mot-clé | IPC 6013E |