IPC 6013E:2021

IPC 6013E:2021

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

195,00 €

Détails

This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes (PTHs), and blind/buried vias. The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.Revision level changes are described in 1.7.

Informations supplémentaires

Auteur Association Connecting Electronics Industries (IPC)
Edité par IPC
Type de document Norme
Thème /subgroups/55721
EAN ISBN 9781638160205
Nombre de pages 84
Remplace IPC 6013D,IPC 6013C,IPC 6013B,IPC 6013A
Mot-clé IPC 6013E