Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
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PDF sécurisé |
Chinois |
Active |
27/07/2021 |
249,00 € |
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PDF sécurisé |
Anglais |
Active |
27/07/2021 |
231,00 € |
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Papier |
Chinois |
Active |
27/07/2021 |
336,00 € |
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Papier |
Anglais |
Active |
27/07/2021 |
318,00 € |
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Détails
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
Informations supplémentaires
Auteur | Association Connecting Electronics Industries (IPC) |
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Edité par | IPC |
Type de document | Norme |
Thème | /subgroups/55721 |
EAN ISBN | 9781638160151 |
Nombre de pages | 156 |
Remplace | IPC 4552A,IPC 4552-WAM1-2,IPC 4552 |
Mot-clé | IPC 4552B |