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195,00 € |
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01/10/2020 |
157,00 € |
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01/10/2020 |
231,00 € |
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Chinois |
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01/10/2020 |
255,00 € |
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Anglais |
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01/10/2020 |
217,00 € |
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01/10/2020 |
318,00 € |
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Détails
IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision B provides new design guidance and requirements for laminate selection, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios, via hole size and printed board edge spacing.
Informations supplémentaires
Auteur | Association Connecting Electronics Industries (IPC) |
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Edité par | IPC |
Type de document | Norme |
Thème | Design |
Edition révision n° | 0 |
EAN ISBN | 978-1-951577-71-1 |
ICS | 31.180 : Cartes et circuits imprimés
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Nombre de pages | 36 |
Remplace | IPC 2222A, IPC 2222 |
Poids (kg.) | 0.16 |
Mot-clé | 2222-STD-0-D-0-EN-B, 2222-STD-0-D-0-EN-B |