| Nom | Support | Langue | Disponibilité | Date d'édition | Prix | ||
|---|---|---|---|---|---|---|---|
|
Papier |
Chinois |
Active |
01/10/2022 |
256,00 € |
|
||
|
PDF sécurisé |
Chinois |
Active |
01/10/2022 |
196,00 € |
|
||
|
Papier |
Anglais |
Active |
01/10/2022 |
254,00 € |
|
||
|
PDF sécurisé |
Anglais |
Active |
01/10/2022 |
194,00 € |
|
||
Détails
This standard prescribes test methods, defect de?nitions, and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes (PTHs). This standard is intended for use by both user and supplier.This standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. This standard describes procedures or methods to determine the acceptable wettability of a surface ?nish. Wettability can be affected by handling, ?nish application, and environmental conditions.
Informations supplémentaires
| Auteur | Association Connecting Electronics Industries (IPC) |
|---|---|
| Edité par | IPC |
| Type de document | Norme |
| EAN ISBN | 9781638160908 |
| Nombre de pages | 44 |
| Remplace | IPC J-STD-003C-WAM1&2,IPC J-STD-003C-WAM1,IPC J-STD-003C,IPC J-STD-003B,IPC J-STD-003A,IPC J-STD-003 |
| Poids (kg.) | 0.17 |
| Mot-clé | IPC J-STD-003D |
